Laser bonding apparatus for three-dimensional molded sculptures

ABSTRACT

Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the priority of Korean Patent Application No.10-2016-0136477, filed on Oct. 20, 2016, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference. Further, this application is the National Phase applicationof International Application No. PCT/KR2017/006584 filed Jun. 22, 2017,which designates the United States.

TECHNICAL FIELD

The present invention relates to a laser bonding technique, and moreparticularly, to a laser bonding apparatus and a bonding method capableof bonding a semiconductor wafer to a three-dimensional structure havinga regular or irregular shape in a curved portion such as an automobiletail lamp or a headlamp.

BACKGROUND

A laser bonding is preferred to the conventional wire bonding since theelectronic devices become smaller and more sophisticated and thesemiconductor packaging technology for protecting semiconductor chipsfrom various external environments such as dust, moisture orelectrical/mechanical loads has encountered limitations in making thedevices lighter, thinner and smaller by the conventional wire bondingmethod. The laser bonding is a method in which a semiconductor chip isattached to a circuit pattern on a circuit board or a circuit tape andis bonded using a laser.

Japanese Patent Registration No. 3303832 discloses a laser bondingtechnique for collectively connecting each electrode of a semiconductorchip to a substrate. According to Japanese Patent No. 3303832, anadsorption head for adsorbing a semiconductor chip is made of glassthrough which a laser beam is transmitted, and a Peltier element iscoupled to the stage. The semiconductor chip is rapidly heated bydirectly heating the entire semiconductor chip by the laser beam. Thesubstrate is rapidly heated and cooled by the Peltier element coupled tothe stage.

U.S. Patent Publication No. 2016/004938 relates to semiconductor chippackaging, and discloses a bonding technique using a laser forconnecting a semiconductor chip die to a circuit board. According toU.S. Patent Publication No. 2016/004938, a bump reflow step is disclosedin which a laser beam is directed toward a semiconductor die tovolatilize flux and electrically connect a bump to a circuit pattern.

In Korean Patent No. 10-0913579, a device for bonding a driving circuitboard such as FPC (Flexible Printed Circuit), TCP (Tape CarrierPackage), CBF (Common Block Flexible Printed Circuit), Driver IC (DriverIntegrated Circuit) is disclosed. According to Korean Patent No.10-0913579, a board to be bonded with a driving circuit board istransferred to and from a bonding operation position to be bonded withthe driving circuit board, thereby reducing a tact time and speeding upthe operation.

In general, a reflow apparatus is used for attaching a device includingan electronic component such as a semiconductor chip or integratedcircuit (IC), a transistor (TR), a resistance element (R), and acapacitor (C) to a printed circuit board. Currently, the reflowapparatus may be classified into mass reflow type and laser reflow type.

A mass reflow apparatus mounts a plurality of substrates with soldermaterial such as solder balls, solder pads, or solder paste on theconveyor belt and drives the conveyor belt. The substrate is passedalong the conveyor belt through a heating zone equipped with an infraredor ceramic heater. The infrared heaters are provided on the upper andlower sides of the conveyor belt to apply heat to the solder material onthe substrate to attach the semiconductor elements thereto.

According to the mass reflow apparatus, the electronic component ordevice is subject to thermal stress for about 210 seconds at a hightemperature of about 50° C. or up to 230 to 290° C. Accordingly, thereis a problem that the electronic component or device may be damaged byheat, thereby deteriorating the characteristics or lifetime of theelectronic component or device. In addition, there is a problem that ittakes a long time of about 3 to 10 minutes for the infrared heater toheat the solder material to bond the electronic component or device tothe substrate, which is not economical. In addition, the mass reflowprocess may cause defects by applying heat to all components on thesubstrate including the ones that are susceptible to heat, and causethermal deformation on the overall substrate since heat is applied tothe entire substrate.

Meanwhile, automotive headlights have recently been replaced by LEDs.The structures of the substrate for LED headlight vary fromtwo-dimensional to three-dimensional shapes. In the case of an irregularsubstrate such as a step-shaped or a bowl-shaped substrate on which theLED is mounted, when the LED is bonded to the irregular substratethrough the mass reflow process the heat energy is unevenly distributedon the substrate to cause bonding defects, and thermal energy is appliedto the substrate as a whole thereby increasing the possibility thatthermal deformation may occur throughout the entire substrate.

In addition to automobile headlights, it is difficult to avoiddisadvantages of the mass reflow process when the shape of the substratefor bonding semiconductor chips is three-dimensional or irregular.

Therefore, when the substrate is three-dimensional or irregular a laserreflow technique can be a very useful solution. The laser reflowtechnique is capable of irradiating a homogenized laser beam for eachbonding site and easily adjusting each irradiation region of the laserbeam.

Nevertheless, the laser reflow technique so far has only been applied tosubstrates having a generally planar shape, such as PCBs and glasssubstrates used in devices such as mobile phones and TVs. If thesubstrate is not provided in a planar form, or if the locations wherethe semiconductor element is attached are totally irregular, theconventional laser bonding apparatus cannot operate on such substrate.

Accordingly, there is a need for a new laser bonding apparatus andmethod that can effectively bond electronic components or elements toany shape of three-dimensional structures including automotive taillamps or headlamps as shown in FIG. 1.

SUMMARY Technical Problem

It is an object of the present invention to provide a laser bondingapparatus and method for a three-dimensional structure capable ofbonding electronic elements to any type of three-dimensional structure.The present invention may apply not only to a substrate having a planarshape such as a flat PCB substrate and a glass substrate but also to athree-dimensional substrate including a curved portion of a regular orirregular shape.

Another object of the present invention is to provide a laser bondingand method for a three-dimensional structure that can preventmisalignment of a three-dimensional structure with respect to anelectronic component and a bonding failure caused thereby.

Other objects of the present invention will become readily apparent fromthe following description of the embodiments.

Technical Solution

According to some embodiments, a laser bonding apparatus forthree-dimensional structures comprises: a three-dimensional structureproviding unit for providing a plurality of three-dimensional structuresto which adhesives are applied and electronic components are attached,and a laser boding unit for bonding the electronic components to thethree-dimensional structures by irradiating a laser beam to theelectronic components attached to the three-dimensional structures.

According to some embodiments, a laser bonding apparatus forthree-dimensional structures comprises: an electronic componentproviding unit for mounting and transporting a plurality of electroniccomponents, a three-dimensional structure providing unit for supportingand conveying a plurality of three-dimensional structures, an adhesivematerial applying unit for applying adhesive material to one of thethree-dimensional structures, an electronic component attaching unit forattaching an electronic component to the three-dimensional structure onwhich the adhesive material is applied, and a laser bonding unit forbonding the electronic component to the three-dimensional structure byirradiating a laser beam to the electronic component attached to thethree-dimensional structure.

In the above embodiments, the three-dimensional structure have a curvedportion with regular or irregular shape. Specifically thethree-dimensional structure is is a structure for an automobile taillamp or an automobile headlamp.

According to some embodiments, a laser bonding method for athree-dimensional structure comprises the steps of: mounting a pluralityof three-dimensional structures to a working table; conveying theworking table on which the the three-dimensional structures are mountedby a working table conveying unit; applying adhesive material to one ofthe three-dimensional structures; picking up and attaching an electroniccomponent to the three-dimensional structure on which the adhesivematerial is applied; and bonding the electronic component to thethree-dimensional structure by irradiating a laser beam to theelectronic component attached to the three-dimensional structure. Theadhesive material is solder paste or NCP and the three-dimensionalstructure is a structure for an automobile tail lamp or an automobileheadlamp.

Effects of the Invention

The laser bonding apparatus for a three-dimensional structure accordingto the present invention provides the following effects.

First, it is possible to laser bond an electronic component to athree-dimensional structure including a curved portion of a regular orirregular shape.

Second, it is possible to prevent misalignment of a three-dimensionalstructure with respect to an electronic component and bonding failurecaused thereby, as well as to prevent defective application of anadhesive material and poor adhesion of the electronic component to thethree-dimensional structure.

It should be understood that the effects of the present invention arenot limited to the effects described above, but include all effects thatcan be induced from the details of specification or the configuration ofthe invention described in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exemplary view for explaining a three-dimensionalstructure.

FIG. 2 is an exemplary view for explaining a laser bonding apparatus fora three-dimensional structure according to the present invention.

FIG. 3 is an exemplary view for explaining the operation of the laserapparatus for a three-dimensional structure according to the presentinvention.

FIG. 4 is an exemplary view illustrating a process of bonding anelectronic component to a three-dimensional structure using a laserbonding apparatus for a three-dimensional structure according to thepresent invention.

FIG. 5 is an exemplary view for explaining a three-dimensional structureproviding unit used for providing a three-dimensional structure havingan irregular shape.

FIG. 6 is a flowchart illustrating a laser bonding method for athree-dimensional structure according to the present invention.

DESCRIPTION OF EMBODIMENTS

Hereinafter, the present invention will be described with reference tothe accompanying drawings. The present invention may, however, beembodied in many different forms and should not be construed as limitedto the embodiments set forth herein.

Throughout the specification, when a member or an element is referred toas being “connected” (connected, combined or coupled) with anothermember, it may be referred to as not only “directly connected” but also“indirectly connected”. When a member “comprises” a certain element, itmeans that it can include other element unless specifically statedotherwise.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be a limitation to the presentinvention. A singular form such as “a,” “an,” and “the” may includeplural referents unless the context clearly dictates otherwise. In thisspecification, the terms “comprise”, “including” or “having” and thelike are intended to specify that there are stated features, numbers,steps, operations, elements, parts or combinations thereof. The use ofthe terms “comprise”, “including” or “having” and the like do notpreclude the presence or addition of one or more other features,numbers, steps, operations, components, parts, or combinations thereof.

The laser bonding apparatus for a three-dimensional structure accordingto the to the present invention is implemented to laser-bond anelectronic component to a a three-dimensional structure (e.g., anautomotive taillight or a headlight) as shown in in FIG. 1. Thethree-dimensional structure can be implemented as a mold manufactured byinjection molding. In the past, bonding of three-dimensional structureswas done by soldering, but the inventor(s) of the present applicationdeveloped a laser bonding apparatus for a three-dimensional structure inorder to reduce the manufacturing time as the paradigm of amanufacturing industry is being gradually changed to a new concept of asmart factory and customized mass production.

The laser bonding apparatus 200 for a three-dimensional structureaccording to an embodiment of the present invention comprises athree-dimensional structure providing unit for providing a plurality ofthree-dimensional structures applied with an adhesive material to whichelectronic components are to be attached, and a laser bonding unit forbonding the electronic components attached to the plurality ofthree-dimensional structures by irradiating a laser beam. According tothis embodiment, the process of applying the adhesive material on thesurface of the three-dimensional structure and attaching the electroniccomponent device to the adhesive material can be performed by a separateapparatus. In this case, the three-dimensional structure providing unitof the laser bonding apparatus 200 for a plurality of three-dimensionalstructures according to the present invention will only perform theoperation of transporting the plurality of three-dimensional structuresto their bonding positions.

Referring to FIG. 2, the laser bonding apparatus 200 for athree-dimensional structure according to the present invention includesnot only an electronic component providing unit 210 but also athree-dimensional structure providing unit 250, an adhesive materialapplying unit 220, an electronic component attaching unit 230, and alaser bonding unit 240.

The electronic component providing unit 210 mounts and transports aplurality of electronic components. The electronic component may includeat least one of a semiconductor chip, an IC, an LED element, a resistor,a capacitor, an inductor, a transformer, a relay and so forth. Theelectronic component providing unit 210 includes a tray 211 on which aplurality of electronic components are mounted and a tray transportingunit 212 for transporting the tray 211 in a predetermined direction.

The three-dimensional structure providing unit 250 supports and conveysa plurality of three-dimensional structures in a predetermineddirection. A plurality of three-dimensional structures may include athree-dimensional structure (for example, an automobile tail lamp or aheadlight instrument) in which the bent portions have both a regular orirregular shape.

The three-dimensional structure providing unit 250 may be implemented toinclude a working table 251 for supporting a plurality ofthree-dimensional structures and a working table conveying unit 252 forconveying the working table on which the plurality of three-dimensionalstructures are mounted.

The adhesive material applying unit 220 applies, for example, solderpaste or non-conductive adhesive (NCP) to the plurality ofthree-dimensional structures. Non-conductive adhesives, hereinafterreferred to as “NCP”, can be implemented, for example, withN-methyl-3-amino propyltrimethoxysilane as a coupling agent andpolyester acrylate as an adhesion promoter.

The adhesive material applying unit 220 includes a dispenser 223 forapplying solder paste or NCP to the plurality of three-dimensionalstructures placed on the working table 251, a first transfer unit 222that transfers the dispenser 223 both vertically and horizontally withina plane perpendicular to the tray transporting direction, and a firstgantry 221 that supports the first transfer unit 222.

The adhesive material applying unit 220 may be implemented by furtherincluding a first monitoring unit that detects an alignment state of thedispenser with respect to the three-dimensional structure and anapplication state of a solder paste or NCP. The first monitoring unitmay include a CCD camera and a capture board for capturing an image, anda control unit for comparing the image input from from the imageprocessing board with the reference image to determine whether the thealignment and application states are within normal ranges.

The electronic component attaching unit 230 attaches the electroniccomponent to a portion of the three-dimensional structure to whichsolder paste or NCP is applied. The electronic component may include atleast one of a semiconductor chip, an IC, an LED element, a resistor, acapacitor, an inductor, a transformer, or a relay.

The electronic component attaching unit 230 includes a component attach233 for picking up an electronic component from the tray 211 andattaching it to a portion of a plurality of three-dimensional structureto which solder paste or NCP is applied. The electronic componentattaching unit 230 further includes a second transfer unit 232 thattransfers the component attach 233 both vertically and horizontallywithin a plane perpendicular to the tray transporting direction, and asecond gantry 231 that supports the second transfer unit 232.

The electronic component attaching unit 230 may further include a secondmonitoring unit that detects an alignment state of the electroniccomponent with respect to the three-dimensional structure and anattachment state of the electronic component to the three-dimensionalstructure. The second monitoring unit may include a CCD camera and acapture board for capturing an image, and a control unit for comparingthe image input from the image processing board with the reference imageto determine whether the alignment and attachment states are withinnormal ranges.

The laser bonding unit 240 irradiates laser beam of line or square typeto the electronic component attached to the three-dimensional structureto bond them each other. An exemplary laser bonding unit 240 includes alaser beam irradiating unit 243, a third transfer unit 242 for movingthe laser beam irradiating unit 243 vertically and horizontally within aplane perpendicular to the direction of tray transport, a third gantry241 that supports the third transfer unit 242.

The laser beam irradiating unit 243 may include a laser oscillator thatemits laser beam to an electronic component attached to thethree-dimensional structure, and a beam shaper and an optical system forconverting a laser beam having Gaussian distribution outputted from thelaser oscillator into square or rectangular surface beam having auniform energy distribution.

The beam shaper may be embodied as a light guide forming a homogenizedrectangular beam. The light guide may be installed to have a distance of0.2 to 0.5 mm from the optical fiber that conveys the laser beam fromthe laser oscillator. The light guide may have a length between 1.0 to1.5 meters. If the length of the light guide is less than 1.0 m, theoptical homogeneity of the laser light outputted from the light guideafter undergoing diffused reflection inside the light guide can bedecreased thereby degrading the uniformity in the temperaturedistribution in the irradiation region of the workpiece (P). On theother hand, if the length of the light guide is set to be more than 1.5,the optical homogeneity of the laser beam becomes very good. However,the total length of the optical homogenization module including the beamshaper and optical system becomes too much long, which increases themanufacturing cost and inconvenience in storing and transporting theoptical homogenization module.

No optical lens is required between the light guide and the opticalfiber to make the laser beam uniform. Since the distance between thelight guide and the optical fiber is between 0.2 and 0.5 mm and thenumerical aperture (NA) of the optical fiber is within 0.2 to 0.3 range,all of the laser beam emitted from the optical fiber can be incidentinto the light guide.

The light guide is formed as a rectangular parallelepiped having arectangular cross section using a base material having a hightransmittance through which the laser light can pass. A total reflectioncoating film is formed on the sidewall parallel to the optical axis ofthe laser beam. An anti-reflective coating film is formed on both theupper and lower surfaces that are perpendicular to the optical axis.Thus, the laser beam passing through the light guide can be preventedfrom being lost outwardly.

The optical system can be realized, for example, by a condensing lensfor condensing the divergent uniformized rectangular beam emitted fromthe light guide guide and a diverging lens for diverging the condenseduniformized rectangular beam beam while maintaining the uniformity ofthe beam up to a certain working distance. The combination of the radiiof curvature of the condensing lens and the diverging lens allows thecontrol of the size of the uniformized rectangular beam and the workingdistance.

The laser bonding unit 240 may include a third monitoring unit thatdetects an alignment state of the laser irradiating unit 243 withrespect to the three-dimensional structure and a bonding state of theelectronic component to the three-dimensional structure. The thirdmonitoring unit may include a CCD camera and a capture board forcapturing an image, and a control unit for comparing the image inputfrom the image processing board with the reference image to determinewhether the alignment and bonding states are within normal ranges.

The laser bonding unit 240 may be implemented to adjust the irradiationintensity and the irradiation region of the laser beam according to theshape of the three-dimensional structure as the working table 251 onwhich the plurality three-dimensional structures are placed is beingmoved. Accordingly, even when the shape of the substrate isthree-dimensional or irregular, it is possible to irradiate auniformized laser beam to each bonding site and easily adjust eachirradiation region of the laser beam.

FIG. 3 is an exemplary view for explaining the operation of the laserbonding apparatus for a three-dimensional structure having a regularshape, and FIG. 4 is an exemplary view for explaining a process forbonding electronic components to the three-dimensional structure havinga regular shape using the laser bonding apparatus in FIG. 3.

Referring to FIG. 3, the laser bonding apparatus for a three-dimensionalstructure having a regular shape includes first and second workingtables 251 and for respectively supporting a plurality ofthree-dimensional structures 110, and first second working tableconveying units 252 and 262 for conveying the first and working tables251 and 261, respectively. The number of working tables and tableconveying units can vary depending on the amount of required productionof device to be bonded.

The tray transporting unit 212 for transporting the tray 211 on whichthe plurality of electronic components are mounted can be installedseparately from the first and second working table conveying units 252and 262 as shown in FIG. 3. The tray 211 is loaded on the traytransporting unit 212 to be transported, and is discharged to theoutside when used up.

The first and second working tables 251 and 261 are conveyed by thefirst and second working table conveying units 252 and 262 to pass thefirst gantry 221. The dispenser 223 for applying solder paste or NCP tothe plurality of three-dimensional structures 110 and the first transferunit 222 for transferring the dispenser 223 both vertically andhorizontally within a plane perpendicular to the tray transportingdirection are installed in the first gantry 221. A vision module fordetecting an alignment state of the dispenser with respect to thethree-dimensional structure and an application state of a solder pasteor NCP may be further installed in the first gantry 221.

When the solder paste or NCP is applied to the plurality ofthree-dimensional structures, the first and second working tables 251,261 are conveyed by the first and second working table conveying units252, 262, respectively, to pass the second gantry 231. The componentattach 233 and the second transfer unit 232 are installed in the secondgantry 231. The component attach 233 is used for picking up anelectronic component from the tray 211 and attaching it to a portion ofthe three-dimensional structure to which solder paste or NCP is applied,and the second transfer unit 232 is used for transferring the componentattach 233 both vertically and horizontally within a plane perpendicularto the tray transporting direction. A vision module for detecting analignment state of the component attach 233 with respect to thethree-dimensional structure 110 and an attachment state of the of theelectronic component to the three-dimensional structure 110 may befurther installed in the second gantry 231.

When the electronic components are attached to the three-dimensionalstructures 110, the first and the second working tables 251, 261 areconveyed by the first and the second working table conveying units 252,262 to pass the third gantry 241. The laser beam irradiating unit 243and the third transfer unit 242 are installed in the third gantry 241. Avision module for detecting an alignment state of the laser beamirradiating unit 243 with respect to the three-dimensional structure 110and an a laser bonding state of the electronic component to thethree-dimensional structure 110 may be further installed in the thirdgantry 241.

Referring to FIG. 4, the three-dimensional structures 110 are mounted onthe working table 251 to be conveyed by the working table conveyingunit. In a sequential order, a solder paste or NCP 30 is applied by thedispenser 223 to the three-dimensional structures 110, the electroniccomponent 40 is attached by the component attach 233 to the solder pasteor the NCP 30, and the electronic component 40 is bonded by the laserbeam irradiating unit 243 to the three-dimensional structure.

Heretofore, the apparatus and method for bonding electronic componentsto a plurality of three-dimensional structures having a regular shapeusing three-dimensional structure providing unit with regard to FIGS. 3and 4.

Hereinafter, a three-dimensional structure providing unit for handlingthree-dimensional structures having irregular shape will be explainedwith reference to FIG. 5.

Referring to FIG. 5, the three-dimensional structure providing unitincludes a seat 511 on which a plurality of three-dimensional structures120 having irregular shape are seated, a driving shaft 512 connected tothe seat 511, a driving belt 513 connected to the driving shaft 512, afirst motor 521 for rotating the driving belt 513, a coupler 514 coupledto the driving shaft 512, a support to which the coupler 514 isrotatably coupled, and a second motor 522 connected to the coupler 514to rotate the coupler 514 with regard to its axis.

Although not shown in FIG. 5, the laser bonding apparatus forthree-dimensional structure according to the present invention may beimplemented to comprise a storage unit for storing operation file fordriving the first and the second motors 521, 522 and motor driving unitfor driving the first and second motors according to the operation file.

As shown in FIG. 6, the laser bonding method performed in the laserbonding apparatus for a three-dimensional structure according to FIGS. 3and 4 includes a loading step, an applying step, a pickup and attachstep, a bonding step, and an unloading step.

The loading step S611 includes the step of placing a plurality ofthree-dimensional structures on a working table. The applying stepincludes the step S612 of conveying the working table on which theplurality of three-dimensional structures are mounted by a working tableconveying unit and a step S613 of applying solder paste or NCP to thethree-dimensional structures. For example, the distance, speed andposition of conveying the working table may be preset and stored in thestorage unit of the laser bonding apparatus. However, a monitoring unitincluding a vision module may be used to check whether the working tablehas been exactly conveyed to the preset position and to correct themisalignment, if any. After the step S613, a step of detecting the stateof application of the solder paste or NCP by a monitoring unit todetermine whether the application state is within a normal range.

The picking-up and attaching step includes a step S614 of conveying theworking table and a step S615 of picking up electronic components fromthe tray and attaching it to the three-dimensional structures. Forexample, the distance, speed and position of conveying the working tablemay be preset and stored in the storage unit of the laser bondingapparatus. However, a monitoring unit including a vision module may beused to check whether the working table has been exactly conveyed to thepreset position and to correct the misalignment, if any. After the stepS615, a step of detecting the state of attachment of the electroniccomponent by a monitoring unit to determine whether the attachment stateis within a normal range.

The bonding step includes the step S616 of conveying the working tableand and a step S617 of laser bonding the electronic component to thethree-dimensional structures. For example, the distance, speed andposition of conveying the working table may be preset and stored in thestorage unit of the laser bonding apparatus. However, a monitoring unitincluding a vision module may be used to check whether the working tablehas been exactly conveyed to the preset position and to correct themisalignment, if any. After the step S617, a step of detecting thebonding state of the electronic component by a monitoring unit todetermine whether the bonding state is within a normal range.

The unloading step S618 unloads the three-dimensional structures fromthe working table after the bonding of the electronic components to thethree-dimensional structures.

It will be understood by those having ordinary skill in the art thatvarious changes and modifications may be made without departing from thespirit and scope of the present invention as defined by the followingclaims.

For example, each element or step in the above-explained embodiments maybe implemented by a plurality of distributed or separated elements orsteps.

At the same time, the elements or step described to be distributed orseparated in the above-explained embodiments may be implemented in aconnected, coupled or combined form

NUMBERS IN THE DRAWINGS

-   -   30: solder paste or non-conductive adhesive (NCP)    -   40: electronic component    -   110: three-dimensional structure    -   200: laser bonding device for three-dimensional structures    -   210: electronic component providing unit    -   211: tray    -   212: tray transporting unit    -   211: tray    -   212: tray transporting unit    -   220: adhesive material applying unit    -   221: a first gantry    -   222: a first transfer unit    -   223: dispenser    -   230: electronic component attaching unit    -   231: a second gantry    -   232: a second transfer unit    -   233: component attach    -   240: laser bonding unit    -   241: a third gantry    -   242: a third transfer unit    -   243: laser beam irradiating unit    -   251: a first working table    -   252: a first working table conveying unit    -   261: a second working table    -   262: second working table conveying unit

BEST MODE

Heretofore, the embodiments were explained in their best modes.

INDUSTRIAL APPLICABILITY

The disclosed techniques could be used in an apparatus for laserbonding.

The invention claimed is:
 1. A laser bonding apparatus forthree-dimensional structures comprising: an electronic componentproviding unit for mounting and transporting a plurality of electroniccomponents; a three-dimensional structure providing unit for supportingand conveying a plurality of three-dimensional structures; an adhesivematerial applying unit for applying adhesive material to one of thethree-dimensional structures; an electronic component attaching unit forattaching an electronic component to the three-dimensional structure onwhich the adhesive material is applied; and a laser bonding unit forbonding the electronic component to the three-dimensional structure byirradiating a laser beam to the electronic component attached to thethree-dimensional structure, wherein the electronic component providingunit comprises: a tray on which the plurality of electronic componentsare mounted; and a tray transporting unit for transporting the tray in apredetermined direction.
 2. The laser bonding apparatus according toclaim 1, wherein the three-dimensional structure providing unitincludes: a working table for supporting a plurality ofthree-dimensional structures; and a working table conveying unit forconveying the working table on which the plurality of three-dimensionalstructures are mounted.
 3. The laser bonding apparatus according toclaim 1, wherein the three-dimensional structure providing unitincludes: a seat on which the plurality of three-dimensional structuresare seated; a driving shaft connected to the seat; a driving beltconnected to the driving shaft; a first motor for rotating the drivingbelt; a coupler coupled to the driving shaft; a support to which thecoupler is rotatably coupled; and a second motor connected to thecoupler for rotating the coupler.
 4. The laser bonding apparatusaccording to claim 2, wherein the adhesive material applying unitincludes: a dispenser for applying solder paste or NCP to thethree-dimensional structures mounted on the working table; a firsttransfer unit for transferring the dispenser vertically and horizontallywithin a plane perpendicular to a tray transporting direction; and afirst gantry for supporting the first transfer unit.
 5. The laserbonding apparatus according to claim 4, wherein the adhesive materialapplying unit further includes a first monitoring unit for detecting thealignment state of the dispenser with respect to the three-dimensionalstructures and application state of the solder paste or NCP to thethree-dimension structures.
 6. The laser bonding apparatus according toclaim 2, wherein the electronic component attaching unit includes: anelectronic component attach for picking up the electronic component fromthe tray and attaching the electronic component to the three-dimensionalstructure on which the solder paste or NCP is applied; a second transferunit for transferring the electronic component attach vertically andhorizontally within a plane perpendicular to a tray transportingdirection; and a second gantry for supporting the second transfer unit.7. The laser bonding apparatus according to claim 6, wherein theelectronic component attach further includes a second monitoring unitfor detecting an alignment state of the electronic component attach withrespect to the three-dimensional structures and an attachment state ofthe electronic component to the three-dimensional structures.
 8. A laserbonding apparatus for three-dimensional structures comprising: anelectronic component providing unit for mounting and transporting aplurality of electronic components; a three-dimensional structureproviding unit for supporting and conveying a plurality ofthree-dimensional structures; an adhesive material applying unit forapplying adhesive material to one of the three-dimensional structures;an electronic component attaching unit for attaching an electroniccomponent to the three-dimensional structure on which the adhesivematerial is applied; and a laser bonding unit for bonding the electroniccomponent to the three-dimensional structure by irradiating a laser beamto the electronic component attached to the three-dimensional structure,wherein the laser bonding unit includes: a laser oscillator for emittingthe laser beam to the electronic component attached to thethree-dimensional structure; a laser beam irradiating unit including abeam shaper and an optical system for converting the laser beam havingGaussian distribution outputted from the laser oscillator into square orrectangular surface beam having a uniform energy distribution; a thirdtransfer unit for moving the laser beam irradiating unit vertically andhorizontally within a plane perpendicular to the direction of traytransport; and a third gantry for supporting the third transfer unit. 9.The laser bonding apparatus according to claim 8, wherein the laserbonding unit further includes a third monitoring unit for detecting analignment state of the laser beam irradiating unit with respect to thethree-dimensional structures and a bonding state of the electroniccomponent to the three-dimensional structures.
 10. A laser bondingapparatus for three-dimensional structures comprising: an electroniccomponent providing unit for mounting and transporting a plurality ofelectronic components; a three-dimensional structure providing unit forsupporting and conveying a plurality of three-dimensional structures; anadhesive material applying unit for applying adhesive material to one ofthe three-dimensional structures; an electronic component attaching unitfor attaching an electronic component to the three-dimensional structureon which the adhesive material is applied; and a laser bonding unit forbonding the electronic component to the three-dimensional structure byirradiating a laser beam to the electronic component attached to thethree-dimensional structure, wherein the three-dimensional structure isa structure for an automobile tail lamp or an automobile headlamp.